应用As solders, thermal fuses, fusible alloys, and in semiconductor industry in InAs and InSb forms
基本信息
MDLMFCD00134048
EINECS231-180-0
灵敏度Ambient temperatures.
形态≈0.36g/m
安全信息
TSCA是
阿法埃莎
铁柱, Iron slug
铁箔, Iron foil
铁线, Iron wire
铅颗粒, Lead granules
铅箔, Lead foil
铅丝, Lead wire
镥片状, Lutetium pieces
钼柱, Molybdenum slug
钼溅射靶, Molybdenum sputtering target
钼丝, Molybdenum wire
m.cnreagent.com
