Technical Notes:

1.Used for the vapor deposition (ALD and CVD) of nickel-containing films.

2.The atomic layer deposition of nickel metal films is described using bis(1 ,4-di-tert butyl-1 ,3-diazabutadienyl) nickel(Il) and formic acid as precursors.

3.Precursors for CVD and AL D processes for obtaining nickel, nickel silicide or nickel nitride thin films .

References:

1.Winter, Charles H.; Knisley, Thomas J., U.S.2016, US 9255327 B2 20160209

2.Winter, Charles H.; Knisley, Thomas J.,U.S. Pat. Appl. Publ. 2016, US 201601 52650 A1 201 60602

3.Klesko, Joseph P.; Kerrigan, Marissa M.; Winter, Charles H. Chem. Mater., 2016, 28, 700-703.

4.Knisley, Thomas J.; Saly, Mark J.; Heeg, Mary Jane; Roberts, John L.; Winter, Charles H., Organometallics 2011, 30, 5010-5017.

5. L ansalot-Matras, Clement; Gatineau, Julien; Jurcik, Benjamin J., Jr., PCT Int. Appl. 2013, wo 2013046157 A1201 30404.